发明名称 |
Method of fabricating high density printed circuit board |
摘要 |
Disclosed is a method of fabricating a high density PCB. Electric properties of a high frequency package product are reduced due to an increased length of a circuit even though the increased length of the circuit is necessary to maintain physical strength in the course of fabricating the PCB. Accordingly, a core insulating layer is removed, thereby providing a method of fabricating a slim PCB having a short wiring length.
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申请公布号 |
US2006102383(A1) |
申请公布日期 |
2006.05.18 |
申请号 |
US20050055190 |
申请日期 |
2005.02.10 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHA HYE Y.;SUN BYUNG K.;KIM TAE H.;MOK JEE S. |
分类号 |
H05K3/12;H05K1/11 |
主分类号 |
H05K3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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