发明名称 METHOD FOR MANUFACTURING RIGID FLEXIBLE BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a flying tail type rigid flexible substrate. SOLUTION: The manufacturing method includes the steps of providing a base substrate in which an internal layer circuit pattern is formed at least over its polyimide film, forming a cover-layer such that it protects the internal circuit pattern corresponding to the flexible area excepting the terminal part of the internal circuit pattern, forming the rigid area and flexible area by arranging a pre-preg on the top and bottom surfaces of the base substrate corresponding to the rigid area and arranging a base copper plate on the top surface of the pre-preg that corresponds to the rigid area and flexible area, which is batch laminated, forming an external circuit pattern electrically mutually connected in the rigid area while protecting the base copper plate corresponding to the flexible area, and removing the base copper plate corresponding to the flexible area. The flexible area includes a terminal. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006128686(A) 申请公布日期 2006.05.18
申请号 JP20050311668 申请日期 2005.10.26
申请人 SAMSUNG ELECTRO MECH CO LTD 发明人 YANG JE LEE;YANG DEK-GIN;HWANG JUNG WOOK;YIM KYU HYOK;JUNG HUN CHAI;YOUNG HO LEE;KWANG YUNE KIM;DONG GI AN
分类号 H05K3/46 主分类号 H05K3/46
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