| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a multilayer board which can realize a small quantity large variety production, without reducing productive efficiency, such as a product filling factor of press, an increase of press frequency, by solving the problem concerning the quality that is caused due to pressure after the set pressure conditions for each size have been unified. SOLUTION: The method is used to combine an internal layer circuit board, a prepreg, and a metallic foil or an outer layer material; to stack them in multiple layers; and a manufacture a multilayer board. A dummy board is additionally arranged in the same plane during pressing, product pressure is adjusted, and then two or more kinds of multilayer boards with different sizes are stacked in a multilayer manner in one-time operation. COPYRIGHT: (C)2006,JPO&NCIPI |
