发明名称 Heat dissipation structure
摘要 A heat dissipation structure made of a heat-conductive material, comprising at least one penetration portion which penetrates therethrough. The at least one penetration portion further comprises a solid portion which is located at the center of the at least one penetration portion and provided with a penetration hole penetrating therethrough, and at least one bridge portion which surrounds the solid portion and is connected between the solid portion and the body of the heat dissipation structure.
申请公布号 US7044195(B2) 申请公布日期 2006.05.16
申请号 US20030637374 申请日期 2003.08.07
申请人 DELTA ELECTRONICS, INC. 发明人 CHEN CHIN-MING;HUANG YU-HUNG;WU WEI-FANG
分类号 H05K7/20;H01L23/467 主分类号 H05K7/20
代理机构 代理人
主权项
地址