发明名称 Frequency measuring device, polishing device using the same and eddy current sensor
摘要 A frequency measuring device capable of accurately detecting an end point of polishing a semiconductor wafer by obtaining a frequency measurement result highly accurately in a short period of time. A device FC, which measures the frequency of a measured signal comprises a counting section including a plurality of n-nary counters, a time reference circuit which outputs a time reference signal for every predetermined time interval, and a plurality of gate circuits whose outputs are connected to the inputs of the n-nary counters. The gate circuits receive the measured signal at a first input and receive the time reference signal at the predetermined time intervals at a second input. With this structure, the counting section supplies the frequency measured result of the measured signal every predetermined time interval.
申请公布号 US7046001(B2) 申请公布日期 2006.05.16
申请号 US20010982025 申请日期 2001.10.19
申请人 EBARA CORPORATION 发明人 TADA MITSUO;YAMASAKI HIRONOBU;SUTO YASUNARI
分类号 G01B7/06;H01L21/304;B24B37/013;B24B37/04;B24B49/04;B24B49/10;G01D5/20;G01N27/72;G01R23/10;G01R33/12 主分类号 G01B7/06
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