发明名称 CIRCUIT MODULE
摘要 <p>The present invention is intended to miniaturize a circuit module including a pressure sensing element. In a circuit module of this embodiment, a laminated sheet to which a pressure sensing element and a circuit element are electrically connected is thinned and allowed to occupy as little space as possible. Thus, the entire circuit module is reduced in thickness and saving of space is realized. Moreover, noise caused by an electromagnetic wave, an electric field and the like is shut off by use of reinforcing plates. Thus, pressure information can be converted into accurate electric signals. Furthermore, noise to the outside from the circuit module of the present invention can be shut off.</p>
申请公布号 KR20060043017(A) 申请公布日期 2006.05.15
申请号 KR20050013992 申请日期 2005.02.21
申请人 SANYO ELECTRIC CO., LTD. 发明人 MAEHARA EIJU;KOBAYASHI KENICHI
分类号 G06F3/033;H05K1/02;G01L9/02;H01L23/48;H01R13/62;H05K1/00;H05K1/11;H05K1/18;H05K3/00;H05K3/46 主分类号 G06F3/033
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