发明名称 Die cleaning method
摘要 There is disclosed a die cleaning method for removing a forming-material from a die used in forming the forming-material containing a binder, comprising the steps of: removing a part or all of the binder contained in the forming-material from the die; and removing the forming-material from the die, whereby the forming-material in the die can be removed without damaging or deforming the die for use in forming the forming-material containing the binder.
申请公布号 US7040327(B2) 申请公布日期 2006.05.09
申请号 US20040506970 申请日期 2004.09.08
申请人 NGK INSULATORS, LTD 发明人 WADA YUKIHISA;KANEKO TAKAHISA;NATE MASAYUKI
分类号 B08B7/00;B08B7/04;B08B3/02;B08B5/02;B08B9/00;B28B3/20;B28B7/38;B29C47/08;B29C47/12;B29C47/20;B29K103/00 主分类号 B08B7/00
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