发明名称 |
Method and apparatus for connecting at least one chip to an external wiring configuration |
摘要 |
An electrically conductive connection is produced between a chip and an external wiring configuration that is kept at a distance from the chip by spacers. Electrically conductive contact material is introduced into recesses in the external wiring configuration in order to produce the electrically conductive connection. This can be carried out economically, and allows a mechanically very robust electrical connection from the chip pads to the external wiring planes.
|
申请公布号 |
US7036216(B2) |
申请公布日期 |
2006.05.02 |
申请号 |
US20020252453 |
申请日期 |
2002.09.23 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HAUSER CHRISTIAN;REISS MARTIN;WINDERL JOHANN |
分类号 |
H05K3/34;H01L21/60;H01L23/31 |
主分类号 |
H05K3/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|