发明名称 Device for inspection of solder joints of bga packages on pcbs
摘要 The joint is illuminated using light sources located on the light transmission path from a prism to an image sensor (11). These light sources are connected to the upper ends of light guiding fibers (23) included in the illumination unit. The lower ends of these fibers are located at the light entrance surface of the prism (27). The prism is used to deflect light and has a light entrance opening. The image sensor detects light deflected by the prism and can be connected to a display.
申请公布号 SE0402624(L) 申请公布日期 2006.04.30
申请号 SE20040002624 申请日期 2004.10.29
申请人 OPTILIA INSTR AB 发明人 ESMAEILI SASAN
分类号 G01N 主分类号 G01N
代理机构 代理人
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