发明名称 Verfahren zur Bearbeitung von Halbleitern
摘要 The present invention provides a manufacturing environment (110) for a wafer fab, and an SPC environment (112) for setting control limits and acquiring metrology data of production runs. A computation environment (114) processes the SPC data, which are then analyzed in an analysis environment (116). An MES environment (118) evaluates the analysis and automatically executes a process intervention if the process is outside the control limits. Additionally, the present invention provides for an electrical power management system, a spare parts inventory and scheduling system and a wafer fab efficiency system. These systems employ algorithms (735, 1135 and 1335). <IMAGE>
申请公布号 DE60023395(T2) 申请公布日期 2006.04.27
申请号 DE2000623395T 申请日期 2000.05.25
申请人 APPLIED MATERIALS, INC. 发明人 NULMAN, JAIM
分类号 G05B19/418;H01L21/02;G05B19/042;H01L21/66 主分类号 G05B19/418
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