发明名称 LIGHT EMITTING DIODE AND ITS MANUFACTURING PROCESS
摘要 <P>PROBLEM TO BE SOLVED: To realize a high luminance light emitting diode in which efficiency for taking out light subjected to wavelength conversion by a phosphor can be enhanced and the volume and surface area of the phosphor can be increased. <P>SOLUTION: The light emitting diode 10 comprises a substrate 12, and a pair of external electrodes 14a and 14b extending from the surface of the substrate 12 to the rear surface thereof through the side face wherein an LED chip 16 is secured onto one external electrode 14a arranged on the surface of the substrate 12 and one electrode on the bottom face of the LED chip 16 is connected with one external electrode 14a. The other electrode on the upper surface of the LED chip 16 is connected with the other external electrode 14b through a bonding wire 18. Furthermore, the bonding wire 18 is inserted into a cut 23 formed in a nonwoven fabric 22 carrying a phosphor 20 so that the nonwoven fabric 22 is mounted on the upper surface of the LED chip 16, and the side face of the LED chip 16 is coated and sealed with a translucent coating material 27 mixed with the phosphor 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006108511(A) 申请公布日期 2006.04.20
申请号 JP20040295282 申请日期 2004.10.07
申请人 OKAYA ELECTRIC IND CO LTD 发明人 YAMADA TATSUHIKO;SHIMADA TOSHIO;NAKAMURA TOSHIMICHI;TAKAHASHI SEIICHI;KATO AKIHIRO;WAKATSUKI MASAHARU
分类号 H01L33/44;H01L33/50;H01L33/62 主分类号 H01L33/44
代理机构 代理人
主权项
地址