| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink surface-mounted on a printed circuit board in a state separated from direct thermal and physical contact with components on the printed circuit board, which cools the components by receiving heat by conduction from the components through the printed circuit board. SOLUTION: This heat sink 100 is provided with a single or multiple fins 102 and a single or multiple surface-mounted pads 104 mounted on solder pads on the printed circuit board in a state separated from direct thermal and physical contact with components on the printed circuit board. The surface-mounted pad 104 has an interior aperture 106, and the heat sink 100 is arranged over a small capacitor and the like by the interior aperture 106. COPYRIGHT: (C)2006,JPO&NCIPI
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