发明名称 Brittle workpiece splitting system and brittle workpiece splitting method
摘要 The brittle workpiece splitting system 1 includes a substrate holding mechanism 10 for holding a substrate 51 , and a processing unit 5 for splitting the substrate 51 held by the substrate holding mechanism 10 by a splitting process. The substrate holding mechanism 10 has an edge damper 12 adapted to clamp an edge part of the substrate 51 from the sides of the opposite surfaces of the edge part, and support members 19 for supporting the substrate 51 thereon at a predetermined height. The support members 19 are disposed on the side opposite the side of the edge damper 12 with respect to the intended split line 61 parallel to the edge part of the substrate 51 . The edge damper 12 has an edge holder 15 on which the substrate 51 is seated, and a pressure bar 14 for pressing the substrate 51 against the edge holder 15 to hold the substrate 51 between the edge holder 15 and the pressure bar 14 . Resin members 14 a and 15 a made of an elastic material having comparatively high rigidity are attached to parts, to be brought into contact with the substrate 51 , of the pressure bar 14 and the edge holder 15 , respectively. The support members 19 are made of a low-friction material to permit the horizontal movement of the substrate 51 during the splitting process.
申请公布号 US2006081101(A1) 申请公布日期 2006.04.20
申请号 US20050245031 申请日期 2005.10.07
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 HAYASHI MASAKAZU;NAKATA SHINJI;YAHAGI SUSUMU
分类号 B26D7/10 主分类号 B26D7/10
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