发明名称 Field effect transistor with electroplated metal gate
摘要 Disclosed is a method for making a metal gate for a FET, wherein the metal gate comprises at least some material deposited by electroplating as well as an FET device comprising a metal gate that is at least partially plated. Further disclosed is a method for making a metal gate for a FET wherein the metal gate comprises at least some plated material and the method comprises the steps of: selecting a substrate having a top surface and a recessed region; conformally depositing a thin conductive seed layer on the substrate; and electroplating a filler gate metal on the seed layer to fill and overfill the recessed region.
申请公布号 US2006081885(A1) 申请公布日期 2006.04.20
申请号 US20050228269 申请日期 2005.10.26
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 SAENGER KATHERINE L.;CABRAL CYRIL JR.;DELIGIANNI HARIKLIA;ANDRICACOS PANAYOTIS C.;ANDRICACOS CALIOPI;VEREECKEN PHILIPPE M.;COOPER EMANUEL I.
分类号 H01L29/76;H01L21/28;H01L21/288;H01L21/336;H01L29/49;H01L29/745;H01L29/78 主分类号 H01L29/76
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