| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component supplying device or the like which can mount electronic components formed from a semiconductor wafer, at a high speed and at low cost. <P>SOLUTION: The electronic component supply device, for supplying a large number of electronic components 2 held on a semiconductor wafer 1 by an adhesive film 4 having a thermal exfoliation, includes a releasing means of releasing a large number of electronic components 2 from an adhesive film 4, by heating the adhesive film 4 with the electronic components 2, whose surfaces kept upside on the semiconductor wafer 1 and reducing the adhesive force of the adhesive film 4; and a component holding means for holding the large number of electronic components 2 which are released from a first adhesive film and whose surfaces are kept facing up, from the upper side, collectively reversing the components 2 upside down, in such a manner that the rear surfaces of many components are kept facing up, and then holding the electronic components 2 for easy suction. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
