发明名称 MOUNTING DEVICE, ITS MOUNTING LOAD CORRECTING METHOD AND NOZZLE INSPECTING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To improve loading accuracy upon mounting an electronic component on a substrate by a suction nozzle. <P>SOLUTION: The mounting device mounts the electronic component sucked and retained by the suction nozzle 10 mounted on a suction head moving into XY directions on the substrate fixed at a predetermined position. A load cell 28 for measuring a load when the suction nozzle 10 is descended into a Z direction within a range wherein a suction head is movable to make a suction terminal abut against the load is installed and nozzle operation same as that upon mounting is effected on a load cell to measure the load previously whereby the load set upon mounting is corrected. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006108384(A) 申请公布日期 2006.04.20
申请号 JP20040292958 申请日期 2004.10.05
申请人 JUKI CORP 发明人 IWASE ATSUSHI;KATO HIROKI
分类号 H05K13/04 主分类号 H05K13/04
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