发明名称 |
MOUNTING DEVICE, ITS MOUNTING LOAD CORRECTING METHOD AND NOZZLE INSPECTING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To improve loading accuracy upon mounting an electronic component on a substrate by a suction nozzle. <P>SOLUTION: The mounting device mounts the electronic component sucked and retained by the suction nozzle 10 mounted on a suction head moving into XY directions on the substrate fixed at a predetermined position. A load cell 28 for measuring a load when the suction nozzle 10 is descended into a Z direction within a range wherein a suction head is movable to make a suction terminal abut against the load is installed and nozzle operation same as that upon mounting is effected on a load cell to measure the load previously whereby the load set upon mounting is corrected. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006108384(A) |
申请公布日期 |
2006.04.20 |
申请号 |
JP20040292958 |
申请日期 |
2004.10.05 |
申请人 |
JUKI CORP |
发明人 |
IWASE ATSUSHI;KATO HIROKI |
分类号 |
H05K13/04 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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