发明名称 PACKAGING OF SEMICONDUCTOR DEVICES FOR INCREASED RELIABILITY
摘要 A high reliability radiation shielding integrated circuit apparatus comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the circuit die are shielded from receiving an amount of radiation greater than the total dose of tolerance of the circuit die. In one embodiment, an integrated circuit apparatus for use in high reliability applications is disclosed. The integrated circuit apparatus is designed to be highly reliable and protect integrated circuit die from failing or becoming unreliable due to radiation, mechanical forces, thermal exposure, or chemical contaminates.
申请公布号 EP1647173(A2) 申请公布日期 2006.04.19
申请号 EP20040778051 申请日期 2004.07.12
申请人 MAXWELL TECHNOLOGIES, INC. 发明人 PATTERSON, JANET
分类号 H01L23/552;H01L25/10 主分类号 H01L23/552
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