| 摘要 |
The present invention relates to a method of manufacturing an LED, comprising the steps of: first, forming a tape coppery metal strip; then, continuously pressing circuits on the tape coppery metal strip so as to form a carrier having circuit patterns of electric contacts on which the diode dies can be placed; next, electroplating a plurality of metal layers on the surface of the carrier; then, performing continuous injection molding on the carrier so as to form a protector having a designated shape; and curing and fixing the diode die on the carrier to connect to the terminal contact of the carrier via a metal wire. A conductive or non-conductive adhesive is dropped onto the bonding position between the metal wire and the terminal of the carrier, and a soft paste is further applied to cover the diode die, the metal wire and the terminal. |
