发明名称 |
LASERBEARBEITUNG VON HALBLEITERMATERIALEN |
摘要 |
A semiconductor is cut by directing a green laser beam of high power, and subsequently directing a UV beam along the cut line. The first beam performs cutting with relatively rough edges and a high material removal rate, and the second beam completes the cut at the edges for the required finish, with a lower material quantity removal. |
申请公布号 |
DE60117036(D1) |
申请公布日期 |
2006.04.13 |
申请号 |
DE2001617036 |
申请日期 |
2001.10.26 |
申请人 |
XSIL TECHNOLOGY LTD., DUBLIN |
发明人 |
BOYLE, ADRIAN |
分类号 |
B23K26/36;B23K26/00;B23K26/06;B23K26/40;B23K101/40;H01L21/304;H01L21/78;H01S3/00 |
主分类号 |
B23K26/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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