| 摘要 |
PROBLEM TO BE SOLVED: To provide a protective tape removing method and a protective tape removing device which can accurately release a protective tape integral with an adhesive tape from a semiconductor wafer, by applying a releasing tape to the protective tape bonded on the surface of the semiconductor wafer and releasing the releasing tape from the wafer. SOLUTION: Before a releasing tape Ts is bonded to a protective tape PT on the surface of a wafer held by a dicing tape DT by pushing the releasing tape against an edge member 33 from the rear side of a ring frame f, pure water is dropped from a piston nozzle 48 onto the rear surface of the dicing tape DT provided at the forward side of the adhesion start end of the releasing tape Ts. COPYRIGHT: (C)2006,JPO&NCIPI |
