POLYOLEFINIC LAMINATED FILM AND PRESSURE-SENSITIVE ADHESIVE FILM

摘要

PROBLEM TO BE SOLVED: To provide a polyolefinic laminated film excellent not only in antistatic properties but also in the adhesion between respective layers and the uniformity of elongation and suitable for use in a dicing process of a semiconductor part or the like, and a pressure-sensitive adhesive film comprising it. SOLUTION: The polyolefinic laminated film is constituted by providing an antistatic layer (a) containing an antistatic agent and an acrylic resin and an adhesive layer (b) based on an acrylic resin on one side of a polyolefinic base material film with a tensile elastic modulus of 900 MPa or below and a tensile yield elongation of 10% or above in this order. The pressure-sensitive adhesive film for manufacturing a semiconductor is constituted by forming a pressure-sensitive adhesive layer (d) containing an acrylic pressure-sensitive adhesive on the adhesive layer (b) of the polyolefinic laminated film. COPYRIGHT: (C)2006,JPO&NCIPI