发明名称 METHOD OF FORMING WIRING PATTERN, WIRING PATTERN AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a method of forming a wiring pattern excellent in the reliability of electric connection. SOLUTION: The method of forming the wiring pattern made by the mutually conductive connection of a plurality of electric wirings 32, 36 laminated and arranged by a conduction post 34 includes a step of forming the core post 34c of the conduction post 34 by discharging first liquid droplet containing the constitution material of the conduction post 34, and a step of continuously forming a conductive film 32c from the front surface of the core post 34c to the forming position of the electric wiring 32 by discharging second liquid droplet containing the constitution material of the electric wiring 32. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006100343(A) 申请公布日期 2006.04.13
申请号 JP20040281449 申请日期 2004.09.28
申请人 SEIKO EPSON CORP 发明人 SAKURADA KAZUAKI;UEHARA NOBORU;NIIDATE TAKESHI
分类号 H05K3/10;H05K3/40 主分类号 H05K3/10
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