| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and structure for testing a semiconductor wafer prior to the execution of flip chip bumping process. <P>SOLUTION: An interface assembly (20) for testing a semiconductor wafer prior to the execution of a flip chip bumping process and its method are provided. The interface assembly is equipped with a flip chip-bonding pad (24) having a region for the execution of a bumping process (28). A testing pad (22), which is integrated with the bonding pad, is equipped with a probe region for the execution of a wafer level testing (26) prior to the execution of the bumping process. As a result of integration of the bonding pad with the testing pad, for example, the introduction of propagation delay to passing test signals can be avoided, thereby improving the accuracy and reliability of wafer testing results. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
