发明名称 METHOD OF EXAMINING COMPONENT PACKAGING STATE AND COMPONENT PACKAGING STATE EXAMINING APPARATUS USING THE METHOD
摘要 <P>PROBLEM TO BE SOLVED: To efficiently discriminate whether or not the state of packaging components is suitable. <P>SOLUTION: A substrate created by a mounter just after component supplement or stage exchange is defined as an object to be examined, the substrate is imaged, and an examination picture 30 including a created processing target image 31 or the map image 32 of the substrate is displayed. Upon selecting any component on the processing target image 31, the selected component is displayed with a mark 311 to pay attention thereto, and packaging information (packaging position and direction, article number and the like) corresponding to the component is displayed together with a sample image 36. Further, a check field 37 for packaging state judgement is displayed under the sample image 36. Upon selecting the next component, a result of judgement reflected with an input state to the check field 37 at that time is stored in a memory, and the target to pay attention is then switched to the other component. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006100677(A) 申请公布日期 2006.04.13
申请号 JP20040286668 申请日期 2004.09.30
申请人 OMRON CORP 发明人 MURAKAMI KIYOSHI;ISHIBANE MASATO;KURIYAMA ATSUSHI;YOTSUYA TERUHISA
分类号 H05K13/08 主分类号 H05K13/08
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