发明名称 |
INTEGRATED CIRCUIT MEMORY DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To disclose an integrated circuit memory device having a first column memory cell electrically connected to a pair of first bit lines and a bit line precharge/selection circuit. <P>SOLUTION: The bit line precharge/selection circuit has at least one stacked structure made of thin-film transistors. The thin-film transistors include first PMOS pull-up thin-film transistors and first NMOS pass thin-film transistors. Further, the thin-film transistors are electrically coupled to one of the pair of first bit lines. The first column memory cell includes a thin-film transistor SRAM cell. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006093696(A) |
申请公布日期 |
2006.04.06 |
申请号 |
JP20050267439 |
申请日期 |
2005.09.14 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
JO HIDETAKE;BYUN HYUN-GEUN |
分类号 |
H01L27/11;G11C11/41;H01L21/8244;H01L29/786 |
主分类号 |
H01L27/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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