发明名称 INTEGRATED CIRCUIT MEMORY DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To disclose an integrated circuit memory device having a first column memory cell electrically connected to a pair of first bit lines and a bit line precharge/selection circuit. <P>SOLUTION: The bit line precharge/selection circuit has at least one stacked structure made of thin-film transistors. The thin-film transistors include first PMOS pull-up thin-film transistors and first NMOS pass thin-film transistors. Further, the thin-film transistors are electrically coupled to one of the pair of first bit lines. The first column memory cell includes a thin-film transistor SRAM cell. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006093696(A) 申请公布日期 2006.04.06
申请号 JP20050267439 申请日期 2005.09.14
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 JO HIDETAKE;BYUN HYUN-GEUN
分类号 H01L27/11;G11C11/41;H01L21/8244;H01L29/786 主分类号 H01L27/11
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