| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat-transfer device which is adapted to variations in and thermal expansion of assembly structures. <P>SOLUTION: A heat-transfer device 800 has a heat-dissipating structure which is thermally connectable to a heat source, and the heat-dissipating structure comprises at least two components 802 and 808, which are thermally coupled to each other and configured to slide relative to each other. These components 802 and 808 comprise heat dissipation fins 804 and 810 which are configured to dissipate at least part of heat from the heat source to air around the device. Elasticity is provided by springs 814, shown at the four corners of the structure. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
