| 摘要 |
PROBLEM TO BE SOLVED: To detect a street on the surface of a wafer surely from the rear surface in the method for dicing the wafer from the rear surface. SOLUTION: Prior to dicing a wafer having ground rear surface, rear surface of the wafer is roughened to have an arithmetic average roughness of 0.01μm or less. When the arithmetic average roughness is set at such a level or below, wrong recognition of the street and a grinding scar is eliminated and the street can be detected surely. COPYRIGHT: (C)2006,JPO&NCIPI |
