REDUCTION OF SHEET RESISTANCE OF PHOSPHORUS IMPLANTED POLY-SILICON
摘要
There is a process for reducing the sheet resistance of phosphorus-implanted polysilicon. In an example embodiment, there is an MOS transistor structure (300). The structure has a gate region, drain region and a source region. A method (220) for reducing the sheet resistance of the gate region comprises depositing intrinsic amorphous silicon (221) at a predetermined temperature onto the gate region. An amorphizing species is implanted (222) into the intrinsic amorphous silicon. Phosphorus species are then implanted (223) into the gate region of the MOS transistor structure. A feature of this embodiment includes using Ar+ as the amorphizing species.
申请公布号
WO2006035411(A2)
申请公布日期
2006.04.06
申请号
WO2005IB53208
申请日期
2005.09.28
申请人
KONINKLIJKE PHILIPS ELECTRONICS, N.V.;U.S. PHILIPS CORPORATION;EUEN, WOLFGANG;GROSS, STEPHAN