| 发明名称 |
LEAD FRAME FOR SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SAME |
| 摘要 |
<p>A LEAD FRAME FOR A SEMICONDUCTOR DEVICE INCLUDES A SHEET-LIKE BODY AND A PD COATING (2) INCLUDES NI IN AN AMOUNT OF NOT MORE THAN 2%.IN ANOTHER EMBODIMENT,THE PD COATING (2) INCLUDES CU IN AN AMOUNT OF NOT MORE THAN 0.12%.BY VIRTUE OF LIMITING THE AMOUNT OF NI OR CU TO THESE PARTICULAR LEVELS,THE SOLDERABILITY OF THE LEAD FRAME IS REMARKABLY ENHANCED. (FIG.1)</p> |
| 申请公布号 |
MY122094(A) |
申请公布日期 |
2006.03.31 |
| 申请号 |
MY1998PI00919 |
申请日期 |
1998.03.03 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD |
发明人 |
HISAHIRO TANAKA;MASANORI IKARI |
| 分类号 |
B32B15/00;H01L23/50 |
主分类号 |
B32B15/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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