| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package manufacturing method which can relax stress generated between a relay substrate and a mounting substrate at comparatively low cost. SOLUTION: The semiconductor package 11 is manufactured through a solder melting process, a gap expanding process, and a solder solidifying process. In the solder melting process, a solder bump 70 for interposer-mounting is located between an interposer 31 and a wiring substrate 41. The interposer 31 and the wiring substrate 41 are then joined through the melted solder bump 70 for mounting the interposer. In the gap expanding process, a distance between the interposer 31 and the wiring substrate 41 is enlarged in a state that the solder bump 70 is melted for mounting the interposer. In the solder solidifying process, the solder bump 70 is cooled to be solidified. COPYRIGHT: (C)2006,JPO&NCIPI
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