| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC module for a non-contact type IC card which can be easily electrically connected to the antenna line of a data carrier without generating any problem in quality by preventing the manufacturing process of a data carrier such as an IC card and an IC tag from being complicated. <P>SOLUTION: A semiconductor element is mounted on one face of a die pad by using a lead frame having a die pad, and a connecting part for connecting the lead of the lead frame to an antenna wire for a data carrier is arranged, and the both surface of the package are made in parallel, and the whole part is housed within the thickness of the package, and sealed by resin for sealing. The back face of the die pad is exposed so as to be aligned on one face of the resin for sealing, and a lead as the connecting part is exposed on one face of the resin for sealing at the back face side of the die pad by aligning its outermost side face. Also, the exposed side of the lead is disposed with a recess for positioning the antenna wire in the exposed side. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
