| 发明名称 |
SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD |
| 摘要 |
A power semiconductor arrangement and method is disclosed. One embodiment provides a power semiconductor module. An insulator is arranged between the module and a cooling element, increasing clearances between the power semiconductor module and the cooling element.
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| 申请公布号 |
US2008054442(A1) |
申请公布日期 |
2008.03.06 |
| 申请号 |
US20070846278 |
申请日期 |
2007.08.28 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
KANSCHAT PETER;STOLZE THILO |
| 分类号 |
H01L23/48;H01L21/58;H01L23/36 |
主分类号 |
H01L23/48 |
| 代理机构 |
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