| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for efficiently handling electronic components formed on a common substrate. <P>SOLUTION: In order to handle electronic components (package) 7 formed on the common substrate, the apparatus is provided with a processing unit which comprises a cutting chuck 5 for separating the components, a rinse station, at least one dry station and an output station, a transfer platform for receiving the components from the output station of the processing unit, and an output track for transferring the components to an output position. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
