| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic control device capable of easily manufacturing at low cost and having high performance to dissipate heat. SOLUTION: A printed substrate 115 is fixed to a housing by screws penetrating the printed substrate 115 in a state of sandwich between a case 117 and a cover 119. A molded part 113 is mounted on a mounting surface of the printed substrate 115 and the molded part 113 is disposed between the printed substrate 115 and the cover 119. A protrusion 123 is provided on the cover 119 and a heat conductive material 125 is disposed between the protrusion 123 and the molded part 113. An electronic component 111 molded in the molded part 113 is mounted on a radiating member 121; however, the radiating member 121 is disposed on the cover 119 side and a heat conductive material 125 is disposed between the radiating member 121 and the protrusion 123. COPYRIGHT: (C)2006,JPO&NCIPI
|
