| 摘要 |
The present invention provides a wiring board including a metal plate that has a through hole formed so as to pass though both surfaces thereof by isotropic etching; an insulating layer that covers both surfaces of the metal plate and the inside surface of the through hole; a wiring layer formed on an upper surface of at least one surface of the insulating layer on; and a conductive via electrode formed in the through hole, wherein a diameter of the through hole is 100 mum or less and a ratio of a thickness of the metal plate to the diameter of the through hole is 1 or more, preferably, 1.2 or more.
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