| 发明名称 |
Adhesive film for underfill and semiconductor device using the same |
| 摘要 |
An adhesive film for underfill excellent in relaxation effect of the stress generated in the above semiconductor element and the wiring circuit board and in the connecting electrode parts and also excellent in reliability of electrical connection between the semiconductor element and the wiring circuit board.
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| 申请公布号 |
US7018718(B2) |
申请公布日期 |
2006.03.28 |
| 申请号 |
US20040808380 |
申请日期 |
2004.03.25 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
MATSUMURA AKIKO;UWADA KAZUKI;SADAYORI NAOKI;HOTTA YUJI |
| 分类号 |
B32B27/00;C09J7/02;B32B27/06;C08G18/02;C08G18/09;C08G18/69;C08G18/71;C08L63/00;C09J7/00;C09J175/04;C09J175/14;C09J179/00;H01L21/56;H01L23/29 |
主分类号 |
B32B27/00 |
| 代理机构 |
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代理人 |
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