| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device receiving a solid imaging element in a package whose mounting area is more reduced, and reflow mounting, and also to provide its manufacturing method. SOLUTION: The semiconductor device comprises: a translucent substrate 11 having at least a transparent electrode 12 and a transparent electrode pattern 13; the solid imaging element 14 having an electrode region 15 around the main surface side and provided with a space S between the electrode region 15 and the translucent substrate 11, since the electrode region 15 is connected electrically to the transparent electrode 12; a circuit substrate 21 arranged on the rear surface side of the solid imaging element 14, and provided with a connecting unit 22 connected to the translucent substrate 11 while being provided with the signal transfer route of the solid imaging element 14 formed thereon; and a plurality of external terminals 28 provided on the external mounting surface of the circuit substrate 21 and having respective connecting relation with the signal transfer route. COPYRIGHT: (C)2006,JPO&NCIPI
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