An upper and lower board bonding apparatus which eliminates axial shift, sufficiently ensures parallelism, permits the thickness of an adhesive between the boards to be uniform as much as possible when an upper board (Da) and a lower board (Db) are bonded, and has excellent transfer efficiency. The upper and lower board bonding apparatus is provided with a vacuum chamber apparatus and a transfer apparatus for transferring the upper board (Da) and the lower board (Db) to the vacuum chamber apparatus. The vacuum chamber apparatus is provided with an upper chamber (15a) having an upper board sucking table (16a) and a lower chamber (15b) having a lower board sucking table (16b). The transfer apparatus (10) is provided with an arm (10A) for holding the upper board and the lower board by suction and for transferring them on the upper board sucking table and the lower board sucking table, respectively. The arm is turnably provided and is permitted to shift in the radius direction.
