| 摘要 |
A printed circuit board structure includes three layer substrates and two layer metal sheets, the each substrate formed with a plurality of hole for conducting the each substrate one another. The two layer metal sheets are positioned between the two adjacent substrate, the each metal sheet is formed with grid array penetrated holes. So that the grid array penetrated holes 46, 48 of the metal sheet 36, 38 may be absorbed bent energy from the substrate 30, 32, 34 , thus, the printed circuit board may be decrease the damage to increase the production yield.
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