| 摘要 |
A window via capacitor includes a stacked configuration of at least one bottom layer, a plurality of first and second layers, a transition layer and a cover layer. Alternatively, bottom window and transition layers, a plurality of first and second layers, followed by top window and cover layers are respectively provided. First and second layers are characterized by respective sheets of dielectric material with an electrode plate provided thereon, adjacent pairs of electrode plates forming opposing active capacitor plates. Portions of each electrode plate as well as electrode portions provided on each transition layer are exposed on side portions of the window via capacitor periphery, such that terminations can connect respective first and second polarity electrodes together. Window vias may then be formed through windows provided in the cover layers to effect low inductance electrical connection to the active components of the window via capacitor.
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