| 摘要 |
Apparatus for inline measurement of material removal during a polishing or grinding process including: a. a substantially circular rotatable grinding or polishing pad; and b. a sample holder; and c. a sample with a top, a bottom and one or more side surfaces; the sample holder being arranged to hold the bottom surface of the sample in contact with the pad and the sample holder being connected to a moving device to move the sample to a position at least partially over the rim of the pad, during at least a part of the process, the apparatus also including a detecting device for sampling the distances between a reference mark and a target area in the sample and a plane defined by the bottom surface of the sample during the process.
|
