Alignment apparatus, control method therefor, exposure apparatus, device manufacturing method, semiconductor manufacturing factory, and exposure apparatus maintenance method

摘要

An alignment apparatus including a first position measuring device and a second position measuring device which measure position information of an object to be controlled, a switching device which switches a position measuring system from the first position measuring device to the second position measuring device, depending on a moving area of the object to be controlled, a correction computing device which performs a correction calculation for a measurement result from the first position measuring device using a first correction parameter set to obtain a current position of the object to be controlled, a predicted coordinate computing unit which predicts coordinates of the object to be controlled on the basis of progress of a correction calculation result from the correction computing device, and a reverse correction computing device which performs a calculation for the coordinates predicted by the predicted coordinate computing unit using a second correction parameter set to obtain a command value for the second position measuring device.