发明名称 |
Methods for enhancing die saw and packaging reliability |
摘要 |
A wafer device is disclosed for improving reliability of circuits fabricated in an active area on a silicon substrate. A seal ring is fabricated around the active area, and a shallow trench isolation is also formed between the seal ring and a scribe line by etching into a portion of the silicon substrate, wherein the seal ring and the shallow trench isolation prevent die saw induced crack from propagating to the active area when the active area is cut along the scribe line.
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申请公布号 |
US2006055002(A1) |
申请公布日期 |
2006.03.16 |
申请号 |
US20050196184 |
申请日期 |
2005.08.03 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO. |
发明人 |
YAO CHIH-HSIANG;WAN WEN-KAI;CHI KUAN-SHOU;JENG CHIH-CHERNG;LIANG MING-SHUO;HUANG TAI-CHUN;HSIA CHIN-CHIU;LIANG MONG-SONG |
分类号 |
H01L23/544;H01L21/30 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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