发明名称 Integrated radio frequency module
摘要 A radio frequency (RF) module includes a multilayer substrate having dielectric layers and metallization layers that include one or more circuit elements. The metallization layers are located between the dielectric layers. The RF module also includes a symmetric transmission input associated with the multilayer substrate, an RF element on the multilayer substrate to provide RF functionality, and a balun integrated in the substrate behind the symmetric transmission input.
申请公布号 US2006058000(A1) 申请公布日期 2006.03.16
申请号 US20050175961 申请日期 2005.07.06
申请人 BLOCK CHRISTIAN;FALAGAN MIGUEL;GAVELA ISABEL;FLUHR HOLGER 发明人 BLOCK CHRISTIAN;FALAGAN MIGUEL;GAVELA ISABEL;FLUHR HOLGER
分类号 H04B1/28 主分类号 H04B1/28
代理机构 代理人
主权项
地址