发明名称 CONDUCTIVE PASTE
摘要 A conductive paste is disclosed which exhibits high conductivity even when sintered at 500°C or less and enables to form a thick film on a base without forming an interference fringe or a crack in the base. The conductive paste mainly contains a metal powder, a glass frit and an organic vehicle. The metal powder is composed of 50-99 weight% of spherical particles having an average primary particle diameter of 0.1-1 mum and 1-50 weight% of spherical particles having an average primary particle diameter of 50 nm or less. The glass frit is contained in the conductive paste in an amount of 0.1- 15 weight% relative to the total weight of the glass frit and the metal powder. Preferably, the glass frit contains no lead, has a working temperature of 500°C or less, and has an average particle diameter of 2 mum. This conductive paste is often printed and sintered on a substrate for forming an electrical circuit on the substrate.
申请公布号 KR20060024321(A) 申请公布日期 2006.03.16
申请号 KR20057008178 申请日期 2005.05.07
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 YAMAKAWA MASAHIRO;SHIMODA KOHEI
分类号 H01B1/22;H01B1/00;H05K1/09 主分类号 H01B1/22
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