发明名称 |
Semiconductor equipment having a pair of heat radiation plates |
摘要 |
Semiconductor equipment includes: a semiconductor device; a pair of upper and lower heat radiation plates; and a heat radiation block. The heat radiation block has a planar shape, which is smaller than a planer shape of the semiconductor device. The semiconductor device includes a heat generation portion facing the heat radiation block. The heat generation portion has a periphery edge, which is determined such that a distance between the periphery edge of the heat generation portion and a periphery edge of the heat radiation block is equal to or shorter than 1.0 mm.
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申请公布号 |
US2006055056(A1) |
申请公布日期 |
2006.03.16 |
申请号 |
US20040991490 |
申请日期 |
2004.11.19 |
申请人 |
DENSO CORPORATION |
发明人 |
MIURA SHOJI;OZEKI YOSHIHIKO;NAKASE YOSHIMI;KATO NOBUYUKI;KONDOU TETSUJI;TESHIMA TAKANORI;HIRASAWA NAOKI |
分类号 |
H01L23/48;H01L21/28;H01L23/34;H01L23/36;H01L23/433;H01L23/482;H01L23/488;H01L23/492;H01L29/78 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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