发明名称 Semiconductor equipment having a pair of heat radiation plates
摘要 Semiconductor equipment includes: a semiconductor device; a pair of upper and lower heat radiation plates; and a heat radiation block. The heat radiation block has a planar shape, which is smaller than a planer shape of the semiconductor device. The semiconductor device includes a heat generation portion facing the heat radiation block. The heat generation portion has a periphery edge, which is determined such that a distance between the periphery edge of the heat generation portion and a periphery edge of the heat radiation block is equal to or shorter than 1.0 mm.
申请公布号 US2006055056(A1) 申请公布日期 2006.03.16
申请号 US20040991490 申请日期 2004.11.19
申请人 DENSO CORPORATION 发明人 MIURA SHOJI;OZEKI YOSHIHIKO;NAKASE YOSHIMI;KATO NOBUYUKI;KONDOU TETSUJI;TESHIMA TAKANORI;HIRASAWA NAOKI
分类号 H01L23/48;H01L21/28;H01L23/34;H01L23/36;H01L23/433;H01L23/482;H01L23/488;H01L23/492;H01L29/78 主分类号 H01L23/48
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