发明名称 |
Microelectronic packaging and components |
摘要 |
The present invention is for substrates for use in interposers for electronic packaging purposes. One preferred embodiment of the present invention is a substrate for use in a Spring Connector Matrix (SCM) interposer having an array of electrically insulated spring connectors each having a fixed end portion and a floating end portion resiliently flexibly coupled to its associated fixed end portion and capable of being independently displaceable in a plane substantially perpendicular to the SCM interposer's major surfaces. Another preferred embodiment of the present invention is a substrate intended to be folded along one or more predetermined fold lines for forming a 3D interposer. Folding is intended at wings which may be wholly formed of valve metal material or may include one or more electrically insulated valve metal traces electrically connected to one or more interconnect regions intended for ICs either single or double sided mounted thereon.
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申请公布号 |
US2006057866(A1) |
申请公布日期 |
2006.03.16 |
申请号 |
US20050536354 |
申请日期 |
2005.05.26 |
申请人 |
MIRSKY URI;NEFTIN SHIMON;FURER LEV;SEZIN NINA;DUKHOVNY LEONID |
发明人 |
MIRSKY URI;NEFTIN SHIMON;FURER LEV;SEZIN NINA;DUKHOVNY LEONID |
分类号 |
H01R12/00;G01R1/04;H01L21/44;H01L21/48;H01L21/50;H01L23/34;H01L23/48;H01L23/538;H01L25/065 |
主分类号 |
H01R12/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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