| 摘要 |
PURPOSE:To perform reliable draining and drying in a short time by a method wherein, after a cassette is cleansed by jetting high-pressure water, the cassette is dipped in water in a dipping part and thereafter, the cassette is subjected to draining and drying. CONSTITUTION:A contaminated wafer cassette 40 is charged in a cleaning tank 15 of a cleaning part 11 and is positioned and fixed by a chuck 16. High- pressure water is jetted through nozzles 17 to cleanse uniformly the interior and the exterior of the cassette 40 and to wash away fine powder of Si and so on, dust and so on. The cassette 40 is taken out of the cleaning part 11 and is dipped in water W in a dipping tank 19 of a dipping part 12. Thereby, waterdrops adhered on the cassette 40 are annihilated. The cassette 40 is taken out of the dipping tank 19 and is charged in a draining basket 25 of a drying part 13. A motor 24 is driven to revolve a rotary disc 23 and draining and drying are performed. |
