发明名称 MICROENCAPSULATED HEAT-ACCUMULATING SOLID MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a microencapsulated heat-accumulating solid material consisting of a solid microcapsule containing a latent heat accumulating material, enabling the production of the solid material without causing the breakage of the microcapsule and usable over a long period without lowering the heat-accumulation effect even by repeating the temperature change in a temperature range including the phase-transition temperature. <P>SOLUTION: The microencapsulated heat-accumulating solid material producible without causing the breakage of the microcapsule and keeping the heat-accumulation effect even by repeating the temperature change passing through the phase-transition temperature can be produced by using a solid microcapsule containing a latent heat accumulating material, and having a volume-average particle diameter of <3.5&mu;m and a capsule wall thickness of &ge;1 nm and &le;100 nm. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006063327(A) 申请公布日期 2006.03.09
申请号 JP20050214845 申请日期 2005.07.25
申请人 MITSUBISHI PAPER MILLS LTD 发明人 KONISHI YUICHIRO;IKEGAMI KOSHIRO
分类号 C09K5/06;F28D20/00 主分类号 C09K5/06
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