发明名称 |
METHOD OF PROVIDING PATTERNED EMBEDDED CONDUCIVE LAYER USING LASER AIDED ETCHING OF DIELECTRIC BUILD-UP LAYER |
摘要 |
<p>A method of providing a patterned conductive layer. The method includes: providing a build-up layer comprising an insulating material; laser irradiating selected portions of the build-up layer according to a predetermined pattern of the patterned conductive layer to be provided, laser irradiating comprising using a laser beam having a photon energy higher than a bonding energy of at least some of the chemical bonds of the insulating material to yield predetermined laser-weakened portions of the build-up layer according to the predetermined pattern; removing the laser-weakened portions of the build-up layer to yield recesses according to the predetermined pattern; and filling the recesses with a conductive material to yield the patterned conductive layer.</p> |
申请公布号 |
WO2009032390(A2) |
申请公布日期 |
2009.03.12 |
申请号 |
WO2008US68149 |
申请日期 |
2008.06.25 |
申请人 |
INTEL CORPORATION;LI, YONGGANG |
发明人 |
LI, YONGGANG |
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